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CFD Simulation of Compact Type Mini Channel Heat Exchanger by Using of Water
Abstract—A
heat exchanger is a device that is used to transfer thermal energy
(enthalpy) between two or more fluids, between a solid surface and a
fluid, or between solid particulates and a fluid, at different
temperatures and in thermal contact. In the conventional heat
exchangers, pipes are larger in size which makes heat exchanger bulky.
But in some typical applications such as closed loop gas turbine heat
exchangers, cryogenic applications, heat exchangers used in PWR power
plants, nuclear submarines, etc., size and weight are critical design
constraints on the heat exchanger. Also for high pressure applications
tubes are subjected to high bending stresses. To overcome these
difficulties, compact heat exchangers can be employed. Mini channels
heat exchanger is a type of compact heat exchanger in which mini
channels are machined on metal plates and then such plates are bonded
together. Such an arrangement provides high strength so that it can be
used for high pressure applications. It has been observed that in mini
channels, convective heat transfer coefficient is more than the tubes
used in conventional heat exchangers. Hence, the length for same heat
transfer is greatly reduced which results in reduced overall size and
weight of the heat exchanger. Electronic device are in heavy demand for
computer processor applications and generate large amount of heat. These
high power device can be cooled off very effectively by either liquid
or gas coolant flowing through micro or mini channels. Continuous
research work is ongoing for developing high speed processor which
generate high amount of heat. Cooling of such particular systems
requires high amount of mass flow rate and compactness is also required.
In present work, a mini channel heat exchanger is designed with
assuming inlet and outlet of hot temperature, inlet of cold water
temperature and also the mass flow rates of cold and hot water. This
compact heat exchanger can be used for cooling purpose of electronics
device like silicon chip which would be used for microprocessor. In
order to cool down silicon chip, it is kept in place of hot fluid plate.
Cooling of silicon chip is required to prevent from damage and
subsequently failure. The heat exchanger is designed for obtaining 10°C
of hot fluid.
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